Hello David,

I agree with this. However, I would add that it is possible to "include it and not" in the same time: since the mim is defined by three layers and two masks (metcap and met2), we can have the capacitors in the layout, but we don't stream out the metcap layer, nor perform the extra dielectric and metal deposition steps (efectively realizing two metal plates shorted by vias on the die). Those dies are good for fine-tune the basic steps for MOS and bipolar devices. Later then, we can stream out the metcap mask (leaving all other masks unchanged) and add the two extra layers to the processing. I plan to finish the capacitor layout until Friday latest. What do you think?

Regards,

Ferenc