[Libre-silicon-devel] Mumble conference: ICO white paper
david.lanzendoerfer at o2s.ch
Mon Apr 9 21:12:13 CEST 2018
As Hagen said, this ICO white paper is historical.
However, as soon as we go below 500nm feature size we can not use direct
lithographic exposure anymore without tinkering around with multiple
overlapping mask exposures.
At that point we will use eBeam to develop our new technology until we know
the structures are working and then we'll figure out how to build it with
multiple overlapping masks.
On Monday, 9 April 2018 1:36:17 AM HKT Hagen SANKOWSKI wrote:
> Hello Staf.
> This Paper is somehow historical - I requested it from David during our
> weekly mumble session today.
> On 04/08/2018 04:47 PM, Staf Verhaegen wrote:
> > David Lanzendörfer schreef op zo 08-04-2018 om 22:28 [+0800]:
> >> Hi
> >> Here is the ICO white paper we've discussed in the Mumble conference.
> >> Glad for feedback:
> >> https://docs.google.com/document/d/1XdLKafFeYxJJ69Lj8CvbAB36MNBcKUnrF3OQe
> >> hWtyBc/edit?usp=sharing
> >> <https://docs.google.com/document/d/1XdLKafFeYxJJ69Lj8CvbAB36MNBcKUnrF3O
> >> QehWtyBc/edit?usp=sharing>
> > Only had time to quickly browse through the document. I am surprised by
> > the use of e-beam for prototyping.
> > Did you look at the possible throughput you can get in that way ?
> > With normal litho processing throughput is given in wafers per hour; for
> > e-beam it is in hours per wafer. And this for each litho step.
> > greets,
> > Staf.
> > _______________________________________________
> > Libre-silicon-devel mailing list
> > Libre-silicon-devel at list.libresilicon.com
> > http://list.libresilicon.com/mailman/listinfo/libre-silicon-devel
CEO, David Lanzendörfer
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No.2008 Shennan Boulevard,
Futian District, Shenzhen
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