[Libre-silicon-devel] ESD protection

[David Lanzendörfer]

Hi
The progress in the lab is slowed down by machines, which already have been 
booked and yesterday, it took me half an hour until someone told me, that the 
cooler for the Poly dry etcher wasn't broken, but the pump just turned off 
from now on, when not being in use, because I'm essentially the only person 
etching polysilicon, because no one else works on a CMOS process at NFF... ^^'

Anyway. I'm now so far, that we've got the new poly gates on a STI isolated 
surface:
https://twitter.com/LibreSilicon/status/1126815745734692864

On Monday it's Buddhas birthday, so the lab is closed... again...
Hong Kong. Those folks have so many holidays... If I wouldn't be here already, 
I'd be jealous =^_^=~~

Tuesday I'll attend the formal training for the Cirie200 (nickel dry etch 
machine), as well as finalize implant stop, nimplant, pimplant, annealing,
nitride spacers + silicide block, and then I put it into the furnace for LTO 
deposition.

After LTO, I can etch the contact holes and sputter Nickel+Aluminum+Nickel.

Now that I anyway have to sputter and dry etch Nickel, I decided, that I use 
Nickel instead of Titanium for the interface layers.
This will reduce the via resistance by a factor 10.

Cheers
    David
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