I think we should work on the process using an existing fab with existing machines, as it is hard work to do. So let alone the optics (dispersion, wavelength) of a photo lithography machine. If you get to structure widths that are in the range of the wavelength of the light being used things become difficult as there are interference patterns which are formed with the mask and the light which forces the user to generate special masks that compensate the effects of interference like it is used in holographic technology. Or go for a shorter wave length and use UV lasers for the lithography which are now available. In times where the 1000nm processes were made UV lasers were not commonly available to my knowledge, but just using another laser with an old machine might be a problem because the optics were made for a different wave length but maybe, this can be adjusted by changing the distance of the optics to the waver and/or mask thus forcing major changes to the machine.
It is not that easy, one thing after the other.
Cheers,
Ludwig
On Sun, Feb 10, 2019 at 3:55 AM David Lanzendörfer < david.lanzendoerfer@o2s.ch> wrote:
Hi
Thanks a lot for the reply. I’ll check out the link ASAP. Are there any ongoing known research about this approach? Is it cost efficient for test wafers?
We're not at this point yet, so I couldn't tell.
Cheers David
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