Hi Tim
I would think that you would want diodes, especially ESD structure diodes, and vertical bipolars to test latchup conditions, and maybe some lateral bipolars as well to see what the beta is.
I will put the different types of possible diodes on our wafer into the list of things to test now! Thanks for the input!
And I agree with Staf that you will want to push the design rules, e.g., long metal, poly, and diffusion strips at close spacing to get a statistical distribution of how often they end up shorting.
Okey
Also long thin poly strips to get a statistical distribution of spot defects large enough to cause an open.
Okey. I keep that in mind. Maybe we limit the length of the poly strip to a value which doesn't show these defects during the test run? I mean we could have multiple lengths of poly on the test wafer. Then we measure them multiple times over the wafer and decide what length is "safe" and what produces defects.
Cheers David