Hi all So, because the MFC for the Cl2 has been erratic and the MFC replacement is very time consuming and a new MFC is pretty expensive, we just decided to manually turn off the Cl2 valve and run it with Argon only. Turns out, that ion bombardment was even too slow, when using a pure Argon plasma for etching. I've spent the entire day working with the Cirie200 today and at the end I asked for giving it More Power! *Tim Taylor grunt* With 500W instead of 400W I actually had a usable reaction rate and the nickel film became so thin, that the underlying oxide became visible. Tomorrow I prepare 3 more samples and test the etching with the new recipe.
I keep you informed David