24 Mar
2018
24 Mar
'18
8:54 a.m.
Hi During the meeting we found out that we don't need a nitride hard mask but can use an oxide mask in order to etch silicon with a plasma etcher. Also I've found out that the variation of the CMP machine is terrible (~5um!) Now that we have oxide should we just skip the CMP step and just grow our process oxide for the n-well/p-well construction over it? @Staf: Can you maybe join this weeks mumble meeting and give some feedback? I'll update the document until then, so that we can discuss it. Cheers David