Hello David,
Acc. to the last conversation, the following concerns are identified (some
may be RTFM):
- Step 8.3 equipment is incorrect
- Also step 8.3, is a tunnel oxide of 40nm thick is thin enough, or we need
thinner?
- Between 13.8 and 13.9, a cleaning step seems to be missing
- When are the drain/source implants driven in? Is the annealing during
silicide formation sufficient for drive-in?
- The implantation dose and acceleration for the wells and the base/emitter
layers are the same.
- Implant stop nitride is 40nm grown, but etching is only for 10nm.
- Al etch time is for 600nm, but the metal layer is 620nm thick. Also, will
the Al etcher pass trough Ti?
Regards,
Ferenc