Hello List!
Just a small reminder for our next Mumble Sessions on this Sunday, 17/11/2019, at 21.00 Hong Kong Time.
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Hello List!
Just a small reminder for our next Mumble Sessions on this Sunday, 10/11/2019, at 21.00 Hong Kong Time.
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Hello List!
While doing some homework regarding our PAD cells, I once again looked
into the MOSIC Design Rules for Scalable CMOS [0].
Out of Rule Set 10.x we get the mimimum grid for bonding pad areas with
102 micron.
So my question is here, do somebody has access to bonding machines and
their documentation and can provide the grid of bonding pad areas this
machines usually can handle?
Is this 95u/100u as I still remember? Or are this machines already in
the milli-inch-measured domain, e.g. 4 mil for 101.6u?
Curious,
Hagen.
[0] https://www.mosis.com/files/scmos/scmos.pdf
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Hi all
A warm welcome to our newest recruit in the effort to create 100% free
and open source silicon.
All say hi to Djamel Dellaa who's interested into using our node together
with the layout tool GLADE.
Cheers
-lev
Hello List!
Just a small reminder for our next Mumble Sessions on this Sunday, 03/11/2019, at 21.00 Hong Kong Time.
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Hello List!
Just a small reminder for our next Mumble Sessions on this Sunday, 27/10/2019, at 21.00 Hong Kong Time.
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Hello David!
A news passed by me today that there is a new logic family based on
BJT + Zenner in which you can make working logic in just 4 layers
https://www.eetimes.com/document.asp?doc_id=1335216 , and mixed
signals in 8. Performance is claimed to be "CMOS-like"
Quite remarkable, I think. Are you going with regular CMOS?
Hello David!
A news passed by me today that there is a new logic family based on
BJT + Zenner in which you can make working logic in just 4 layers
https://www.eetimes.com/document.asp?doc_id=1335216 , and mixed
signals in 8. Performance is claimed to be "CMOS-like"
Quite remarkable, I think. Are you going with regular CMOS?